Module hw

omnitiles

Module hw 

Source
Expand description

§Hardware Abstraction Layer (HAL‐level board support)

This module contains low-level, MCU-specific abstractions for the STM32F777 that are safe, thin wrappers over PAC (peripheral access crate) registers or stm32f7xx-hal drivers.

§Modules

  • pins - OmniTiles STM32F777 pin assignments
  • led – Active-high / active-low LED wrapper
  • usart – Blocking TX helpers with core::fmt::Write impl
  • spi – Blocking byte-level SPI and reusable CS abstraction
  • can – Safe wrapper around bxcan with blocking send/receive
  • encoder – TIM2/TIM3 quadrature encoder mode
  • adc – ADC1/ADC2/ADC3 single-channel blocking reads

Re-exports§

pub use adc::Adc;
pub use can::CanBus;
pub use encoder::Encoder;
pub use led::Led;
pub use pins::BoardPins;
pub use spi::ChipSelect;
pub use spi::SpiBus;
pub use usart::Usart;

Modules§

adc
Basic ADC support for STM32F7 using direct PAC register access.
can
Controller Area Network (CAN) abstraction layer.
encoder
Quadrature encoder support via STM32F7 timers in encoder mode.
led
LED abstraction layer.
pins
Pin definitions for STM32F777 MCU for OmniTiles.
pins_f767zi
Pin definitions for the NUCLEO-F767ZI development board.
spi
Serial Peripheral Interface (SPI) abstraction layer.
usart
USART abstraction layer.