Module hw 

Hardware Abstraction Layer (HAL‐level board support)

This module contains low-level, MCU-specific abstractions for the STM32F777 that are safe, thin wrappers over PAC (peripheral access crate) registers or stm32f7xx-hal drivers.

Modules

• pins_v1 - OmniTiles STM32F777 pin assignments for PCB v1
• led – Active-high / active-low LED wrapper
• usart – Blocking TX helpers with core::fmt::Write impl
• spi – Blocking byte-level SPI and reusable CS abstraction
• i2c – Blocking I2C bus wrapper
• can – Safe wrapper around bxcan with blocking send/receive
• encoder – TIM2/TIM3 quadrature encoder mode
• adc – ADC1/ADC2/ADC3 single-channel blocking reads

Re-exports

pub use adc::Adc;

pub use can::CanBus;

pub use encoder::Encoder;

pub use i2c::I2cBus;

pub use led::Led;

pub use pins_v1::BoardPins;

pub use spi::ChipSelect;

pub use spi::SpiBus;

pub use usart::Usart;

Modules

adc

Basic ADC support for STM32F7 using direct PAC register access.

can

Controller Area Network (CAN) abstraction layer.

encoder

Quadrature encoder support via STM32F7 timers in encoder mode.

i2c

I2C abstraction layer.

led

LED abstraction layer.

pins_devboard

Pin definitions for STM32F777 MCU Devboard for OmniTiles.

pins_f767zi

Pin definitions for STM32F767ZI devboard.

pins_v1

Pin definitions for STM32F777 MCU for OmniTiles PCB v1.

spi

Serial Peripheral Interface (SPI) abstraction layer.

usart

USART abstraction layer.